Blog | Gang Dicing Fused Silica

Gang Dicing Fused Silica

Gang dicing of fused silica involves simultaneously cutting or separating multiple optical components made from fused silica material. Fused silica is a high-purity form of glass that consists of silicon dioxide (SiO2). It possesses exceptional optical properties, including transparency across a broad spectral range, making it valuable for various applications in optics and photonics. Here’s a comprehensive overview:

  1. Material Properties:
    Composition: Fused silica is composed of silicon dioxide molecules, exhibiting high purity and homogeneity.
    Transparency: Fused silica is transparent in the ultraviolet (UV), visible, and near-infrared (NIR) regions of the electromagnetic spectrum.
  2. Dicing Techniques:
    Blade Dicing: Utilizes a rotating blade to cut through the fused silica, allowing for simultaneous cutting of multiple optical components.
    Laser Dicing: Involves using a focused laser beam to make precise cuts in the fused silica. This method is suitable for intricate designs and thin materials.
    Abrasive Waterjet Cutting: Employs a high-pressure stream of water mixed with abrasive particles to cut through the fused silica. This method is effective for materials with varying hardness.
  3. Precision Requirements:
    Precision is crucial in optical applications. Gang dicing ensures tight tolerances to meet specific design requirements and maintain optical clarity.
  4. Die Layout and Spacing:
    The arrangement of optical components on the substrate, known as the die layout, and the spacing between components are carefully considered to prevent damage and ensure accurate separation.
  5. Wafer Mounting:
    Before gang dicing, the fused silica substrate is often mounted on a dicing tape or adhesive film to facilitate the dicing process and prevent damage to the components.
  6. Post-Dicing Processes:
    Depending on the application, post-dicing processes such as polishing, coating, or assembly may be required to prepare the individual optical components for integration into optical systems.
  7. Cleanliness and Contamination Control:
    Similar to other optical materials, fused silica requires a clean environment to prevent contamination that could affect the performance of optical components.
  8. Applications:
    Gang dicing of fused silica is employed in the production of various optical components, including lenses, prisms, windows, and other precision optics used in lasers, imaging systems, and telecommunications.
  9. Challenges:
    Challenges in gang dicing fused silica may include avoiding microcracks, maintaining edge quality, and preventing contamination. Specialized processes are often developed to overcome these challenges.
  10. Customization and Expertise:
    Companies with expertise in gang dicing fused silica, such as MTINC, often provide customized solutions and leverage their experience to address specific challenges associated with the material.
    In summary, gang dicing of fused silica is a specialized process that involves simultaneously cutting multiple optical components from a fused silica substrate. The choice of dicing technique and attention to precision are critical to ensuring the quality and performance of the individual optical components produced from this high-purity glass material.