American-Made Dicing Equipment for Semiconductor & Advanced Materials
The PDS-200 is a fully automatic dicing saw engineered for precise singulation of semiconductor packages up to 330 x 330 mm in size. As global demand grows for panel-level packaging (PLP) and fan-out wafer-level packaging (FOWLP) technologies, the PDS-200 is built to meet this challenge—offering high-throughput performance, tight tolerance control, and complete automation in a platform made entirely in the USA.
Manufactured in California, the PDS-200 is the leading U.S.-made solution for companies needing large-format, high-precision cutting capability without relying on overseas equipment or support.
Key Features & Capabilities
✅ Large Format Cutting Area (Up to 330 x 330 mm)
Ideal for panel-level packaging (PLP) and high-density fan-out wafer-level packaging (FOWLP), the PDS-200 supports modern singulation needs across growing substrate sizes.
✅ High-Speed Precision Spindle
Cleanly slices through silicon, GaN, glass, ceramics, and more with high-RPM stability and minimal spindle runout.
✅ Closed-Loop Servo System
Achieve sub-micron accuracy and repeatability with advanced motion control, designed for ultra-thin die and brittle materials.
✅ Fully Automatic Operation
Automated loading, alignment, cutting, and debris management streamline workflows and increase throughput.
✅ Customizable Interface & Process Parameters
User-friendly controls allow for complex patterning, process tuning, and recipe storage to match diverse material and cut requirements.
Why Choose the PDS-200?
- Made in the USA – 100% engineered and manufactured domestically
- Supports PLP & FOWLP formats – Ready for evolving semiconductor packaging trends
- Fast Lead Times – Skip international wait times and shipping delays
- U.S.-Based Support – Work directly with our expert team for maintenance, training, and technical help
- Custom Configurations Available – Designed around your process, not the other way around
Bring Precision Back to American Manufacturing
With the PDS-200, you’re not just buying a dicing saw—you’re investing in a U.S.-built, industry-forward solution that helps restore supply chain independence and lead in next-generation semiconductor production.
Built for U.S. Manufacturing Excellence
As the U.S. semiconductor and defense industries bring production back home, the PDS-200 provides a competitive, domestically manufactured alternative to foreign dicing saws. Trusted across critical sectors, including:
- Semiconductor packaging & singulation
- MEMS and microelectronics
- Advanced ceramics and optical substrates
- Aerospace, defense, and medical devices
DICING SERVICES
With over 40 years of experience, MTINC Machines has developed a reputation as an Industry Leader for high precision CNC machine slicing and dicing services. By providing a solution centric approach to meet the needs of customers across a wide range of industries, our high precision and power dicing saws provide the highest quality cutting services in the industry at sub-micron tolerances with extreme repeatability and reliability. We actively improve our customers products by offering unparalleled insight into slicing and dicing process development; with our wealth of experience in the industry, we can provide the latest cutting-edge technology to maximize productivity, efficiency, and ensure your product is of the highest standards and quality.